Back to the Career Market

Staff Package Design Engineer - Cu FSM/BGBM/Bumping 封装设计专家

Renesas Electronics

Suzhou, Jiangsu, cn

Tailor for this role Original posting

About the role

Staff Package Design Engineer - Cu FSM/BGBM/Bumping 封装设计专家 at Renesas Electronics. Location: Suzhou, Jiangsu, cn. Function: Engineering. Level: Mid-Senior Level. Full job description on the company posting.